Vacuum, nitrogen or formic acid: which reflow approach best fits your production needs?

At SMTA Guadalajara, Keith Bryant brings together industry experts to explore the advantages and limitations of these reflow technologies, whether combining vacuum and nitrogen offers the best of both worlds, and what the future holds for reflow soldering. Joining the discussion: • Luis Antonio Garcia G. — Rehm Thermal Systems SA de CV • Paul Lancaster — HELLER INDUSTRIES, INC. • Bob Bouchard — Director of Sales, Americas, BTU Watch the full panel discussion for expert perspectives on the choices shaping electronics assembly.